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BOM, 3D, and manufacturing release

Use this guide when the design is approaching a downstream manufacturing handoff.

Topics
3
Full sequence
62 min
Format
Task reference

Guide map

Review the project BOM and 3D assembly, then prepare fabrication and assembly outputs.

Diagram of a task guide organized into preparation, procedure, checks, and troubleshooting
Each topic summarizes the key actions, completion checks, and first recovery step.

Topics

Work through only the parts your task requires.

  1. 01

    Review the project BOM

    Reconcile grouped quantities, identity fields, fitted state, and the downloaded BOM against the exact project scope.

    Key actions

    Confirm project and variant scope; Reconcile groups and quantities; Verify identity fields; Inspect fitted and alternate state.

    Complete when

    Hierarchy scope known Variant known

  2. 02

    Review the board in 3D

    Audit model coverage, orientation, board-side placement, and enclosure risk without treating a rendered view as mechanical sign-off.

    Key actions

    Reconcile model coverage; Inspect top and bottom; Check mechanical interfaces; Compare the enclosure envelope.

    Complete when

    Missing models listed Top inspected

  3. 03

    Prepare a manufacturing release

    Freeze a named source state, map receiver requirements, generate a clean package, and inspect every delivered file before handoff.

    Key actions

    Freeze the release source; Build a receiver matrix; Configure Output & Export; Generate into a clean package.

    Complete when

    Source state frozen Receiver matrix complete

When something does not match

Stop at the layer that actually failed.

Preserve the original state, correct the source or configuration, and repeat the affected check. Do not use a clean-looking screen as a substitute for the expected engineering result.
Review the project BOM

Quantities differ
Try: Compare hierarchy inclusion, active variant, duplicate references, grouping fields, and fitted state before editing data.

Review the board in 3D

A component is absent
Try: Check its footprint and model association; do not assume the physical part is absent from the design.

Prepare a manufacturing release

An expected layer is absent
Try: Stop release and compare output configuration, board layer use, and receiver matrix before regenerating into a clean directory.